欢迎访问ic37.com |
会员登录 免费注册
发布采购

CPC1986J 参数 Datasheet PDF下载

CPC1986J图片预览
型号: CPC1986J
PDF下载: 下载PDF文件 查看货源
内容描述: I4 -PAC ™功率继电器 [i4-PAC? Power Relay]
分类和应用: 光电继电器功率继电器输出元件PC
文件页数/大小: 7 页 / 884 K
品牌: CLARE [ CLARE, INC. ]
 浏览型号CPC1986J的Datasheet PDF文件第2页浏览型号CPC1986J的Datasheet PDF文件第3页浏览型号CPC1986J的Datasheet PDF文件第4页浏览型号CPC1986J的Datasheet PDF文件第5页浏览型号CPC1986J的Datasheet PDF文件第6页浏览型号CPC1986J的Datasheet PDF文件第7页  
i4-PAC™ Power Relay
Characteristics
Parameter
Blocking Voltage
Load Current, T
A
=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance
R
JC
1.6
0.65
3
0.35
A
rms
°C/W
CPC1986
Description
Rating
1000
Units
V
P
Clare and IXYS have combined to bring OptoMOS
®
technology, reliability, and compact size to a new
family of high-power Solid State Relays.
As part of this family, the CPC1986 single-pole,
normally open (1-Form-A) Solid State Power Relay is
rated for up to 1.6A
rms
continuous load current with a
5°C/W heat sink.
The CPC1986 employs optically coupled MOSFET
technology to provide 2500V
rms
of input to output
isolation. The output, constructed with efficient
MOSFET switches and photovoltaic die, uses Clare’s
patented OptoMOS architecture while the input, a
highly efficient GaAlAs infrared LED, provides the
optically coupled control. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique i4-PAC package pioneered by IXYS
enables Solid State Relays to achieve the highest load
current and power ratings. This package features a
unique IXYS process in which the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500V
rms
isolation
but also very low thermal resistance (0.35 °C/W).
Features
1.6A
rms
Load Current with 5°C/W Heat Sink
Low 3 On-Resistance
1000V
P
Blocking Voltage
2500V
rms
Input/Output Isolation
Low Thermal Resistance (0.35 °C/W)
Electrically Non-conductive Thermal Pad for Heat
Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Transportation Equipment
Aerospace/Defense
Ordering Information
Part
CPC1986J
Description
i4-PAC Package (25 per tube)
Approvals
UL 508 Certified Component: File E69938
Switching Characteristics
Form-A
I
F
90%
Pin Configuration
1
2
3
-
RoHS
4
+
I
LOAD
t
on
10%
t
off
2002/95/EC
e
3
www.clare.com
1
DS-CPC1986 - R06