CPC1908
PRELIMINARY
2 Thermal Characteristics
Parameter
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to Ambient)
Junction Temperature (Operating)
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Conditions
-
Free Air
-
Symbol
R
θJC
R
θJA
Minimum
-
-
-40
Typical
-
33
-
Maximum
0.35
-
100
Units
°C/W
°C/W
°C
T
J
Heat Sink Rating
R
θCA
=
(T
J
- T
A
) I
L(99)2
I
L
2
•
P
D(99)
- R
θJC
T
J
= Junction Temperature (°C), T
J
≤
100°C *
T
A
= Ambient Temperature (°C)
I
L(99)
= Load Current
with
Case Temperature @ 99°C (A
DC
)
I
L
= Desired Operating Load Current (A
DC
), I
L
≤
I
L(MAX)
R
θJC
= Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
R
θCA
= Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
P
D(99)
= Maximum power dissipation
with
case temperature held at 99ºC = 2.86W
* Elevated junction temperature reduces semiconductor lifetime.
3
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