IXD_602
1.7 Thermal Characteristics
Package
IXDD602D2 (8-Pin DFN)
IXD_602PI (8-Pin DIP)
IXD_602SI (8-Pin Power SOIC)
IXD_602SIA (8-Pin SOIC)
IXD_602SI (8-Pin Power SOIC)
Thermal Resistance, Junction-to-Case
θ
JC
Thermal Resistance, Junction-to-Ambient
θ
JA
Parameter
Symbol
Rating
35
125
85
120
10
°C/W
°C/W
Units
2 IXD_602 Performance
2.1 Timing Diagrams
V
IH
INx
V
IL
t
ondly
90%
OUTx
10%
t
r
t
f
OUTx
90%
10%
t
f
t
r
t
offdly
INx
V
IH
V
IL
t
offdly
t
ondly
Non-Inverting Driver Waveforms
2.2 Characteristics Test Diagram
Inverting Driver Waveforms
+
V
CC
INA
INB
GND
V
IN
Tektronix
Current Probe
6302
OUTA
OUTB
C
LOAD
Tektronix
Current Probe
6302
0.1μF
10μF
V
CC
-
C
LOAD
R02
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