LIA101
Mechanical Dimensions
16 Pin DIP Through Hole (Standard)
7.620
±
.254
(.300
±
.010)
3.429 TYP.
(.135)
7.620 TYP.
(.300)
9.144 TYP.
(.360)
6.350
±
.127
(.250
±
.005)
19.202
±
.381
(.756
±
.015)
2.540
±
.127
(.100
±
.005)
PC Board Pattern
(Top View)
2.540
±
.127
16-.800 DIA. (.100
±
.005)
(16-.031 DIA.)
9.144 TYP.
(.360)
6.350
±
.127
(.250
±
.005)
17.780
±
.127
(.700
±
.005)
7.620
±
.127
(.300
±
.005)
.457
±
.076
(.018
±
.003)
17.780
±
.127
(.700
±
.005)
16 Pin SOIC (“P” Suffix)
7.493
±
.051
(.295
±
.002)
7.493
±
.127
(.295
±
.005)
.254
(.010)
10.160
±
.051
(.400
±
.002)
1.270 TYP.
(.050)
PC Board Pattern
(Top View)
1.270
(.050)
10.363
±
.127
(.408
±
.005)
1.981 TYP.
(.078)
2.108 MAX.
(.083)
1.016
(.040)
9.728
±
.051
(.383
±
.002)
1.193
(.047)
.787
(.031)
.406 TYP.
(.016)
8.890 TYP.
(.350)
Tape and Reel Packaging for 16 Pin SOIC Package
330.2 DIA.
(13.00)
Top Cover
Tape Thickness
.102 MAX.
(.004)
12.090
(.476)
3.175
(.125)
6.731 MAX.
(.265)
2.007
±
.102 1.498
±
.102 3.987
±
.102
(.079
±
.004) (.059
±
.004) (.157
±
.004)
1.753
±
.102
(.069
±
.004)
.406 MAX.
(.016)
7.493
±
.102
(.295
±
.004)
1
16
16.002
±
.305
(.630
±
.012)
10.693
±
.025
(.421
±
.001)
Embossed Carrier
Top Cover
Tape
.050R TYP.
11.989
±
.102
(.472
±
.004)
User Direction of Feed
10.897
±
.025
(.429
±
.001)
1.549
±
.102
(.061
±
.004)
Embossment
Dimensions
mm
(inches)
Rev. X
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