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MP1010 参数 Datasheet PDF下载

MP1010图片预览
型号: MP1010
PDF下载: 下载PDF文件 查看货源
内容描述: 硅桥式整流器 [Silicon Bridge Rectifiers]
分类和应用:
文件页数/大小: 2 页 / 38 K
品牌: COMCHIP [ COMCHIP TECHNOLOGY ]
 浏览型号MP1010的Datasheet PDF文件第2页  
Silicon Bridge Rectifiers
COMCHIP
www.comchiptech.com
MP1000 Thru 1010
Reverse Voltage: 50 - 1000 Volts
Forward Current: 10 Amp
Features
- Diffused Junction
-
-
-
-
-
High Current Capability
High Case Dielectric Strength
High Surge Current Capability
Ideal for Printed Circuit Board Application
Plastic Material has Underwriters
Laboratory Flammability Classification
94V-O
MP-10
H
J
G
+
~
A
E
~
E
-
Mechanical Data
- Case: Molded Plastic
- Terminals: Plated Leads Solderable per MIL
STD-202, Method 208
- Weight: 5.4 grams (approx.)
- Mounting Position: Through Hole for #6
Screw
- Mounting Torque: 5.0 Inch-pounds Maximum
D
C
B
Metal Heat Sink
MP-10
Dim
Min
Max
A
14.73
15.75
B
5.80
6.90
C
19.00
-
D
1.00 Ø Typical
E
5.11
6.14
Hole for # 6 screw
G
3.60
4.00
H
10.30
11.30
o
J
2.38 x 45 C Typical
All Dimensions in mm
Maximum Ratings and Electrical Characterics
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
CHARACTERISTICS
Peak Repetitive Reverse Voltage
Working Peak Rever se Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (Note1) @ T
A
= 50°C
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)
Forward Voltage (per element) @I
F
= 5.0A
Peak Reverse Current
@T
C
= 25°C
At Rated DC Blocking Voltage @T
C
= 100°C
I
2
t Rating for Fusing (t < 8.3ms) (Note2)
Typical Junction Capacitance (Note3)
Typical Thermal Resistance (Note4)
Operating and Storage Temperature Range
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
V
FM
I
R
I
2
t
C
j
R
JC
MP
MP
MP
MP
MP
MP
MP
UNIT
1000 1001 1002 1004 1006 1008 1010
50
35
100
70
200
140
400
280
10
200
1.1
10
1.0
64
110
7.5
-65 to +150
600
420
800
560
1000
700
V
V
A
A
V
uA
mA
A
2
s
pF
K/W
°C
T
j
, T
STG
Note:
1. Non-repetitive for t > 1ms and < 8.3ms.
2. Thermal resistance junction to am bient mounted on PC board with 13.0 x 13.0 x 0.03mm thick land areas.
3. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
4. Thermal resistance junction to cas e per element.
MDS0309003A
Page 1