Audio
Speakers-on-a-Chip
Speakers-on-a-Chip with On-chip Audio DSP, Integrated
I2S/I2C/USB Codec, and Class-D Amplifier
CX20705
Conexant’s portfolio includes a comprehensive suite of semiconductor
solutions for communications and consumer applications.
The CX20705 is one of Conexant’s Speakers-on-a-Chip (SPoC) embedded audio
solutions for designing 2.1 Channel audio entertainment applications. The
device features a proprietary Digital Signal Processor (DSP), Codec, stereo 2.5
Watt Class-D amplifier, capless headphone driver, digital Crossover, and I2S,
USB, and I2C interfaces in a cost-effective single-chip package. The solution
features a suite of turnkey audio post-processing effects specifically designed
for 2.1 Channel audio entertainment applications such as Smartphone/iPOD
docking systems and All-In-One speakers.
This product is part of the CX2070x
SPoC family, which includes CX20702, CX20703, CX20704, CX20706, CX20707 and
CX20709.
The device features multiple high performance 24-bit DACs for 2.1 Channel
speaker output, multiple 24-bit high performance ADCs supporting up to three
stereo line inputs, capless headphone output, support for bi-directional I2S,
PCM, S/PDIF-out with independent sampling rates, and a range of digital and
analog input/output channel selections for flexible routing and mixing. The
integrated digital crossover supports sub-woofer configuration. Different audio
sampling rates ranging from 8 kHz to 96 kHz are generated directly from the
master clock without the need for external PLL. The power-efficient Class-D
amplifier drives a maximum of 2.5 W (average) stereo from the integrated
amplifier. The SPoC can be controlled and configured by both read and write
capability through I2C and Serial Peripheral Interface (SPI). The USB interface is
USB 2.0 Audio Class compliant for both control and data.
The on-chip Digital Signal Processor (DSP) runs a suite of innovative Conexant
proprietary audio post processing effects that dramatically improves sound
quality and frees-up processing power for other applications without
compromising on cost and future firmware scalability. Key audio innovations
include Equalizer, Dynamic Range Compression, Digital Crossover, and
3D effects. The embedded SPoC Configuration Toolbox allows for fast
configuration and performance optimization.
The CX20705 turnkey solution eliminates the need for a multiple-chip reference
design, making it easy and economical for manufacturers to design products
for high quality audio applications. A complete evaluation kit with reference
board and all the necessary technical documents and software is available.
The SoC is packaged in an environmentally-friendly, RoHS/Green-compliant
76-pin QFN (Quad Flat No leads) package.
Distinguishing Features
• 24-bit DAC/Four ADC, SNR 102 dB, THD -
92 dB at 48 kHz 3.3 V
• Programmable on-chip proprietary DSP
– Digital equalizer (10 bands/ channel)
– Dynamic range compression
– Digital Crossover
– 3D Expander (Phantom mode and
Immersion mode)
• USB 2.0 Compliant Audio Class Interface
• One 2-wire I2C or 4-wire SPI slave interface
for external MCU
• 3-wire digital audio I/O (I2S/PCM/SPDIF),
supporting half-duplex receive-only traffic
• Stereo 2.5 W BTL Class-D speaker amplifier
• Flexible power management
• Audio sample rate: 8, 11.025, 12, 16, 22.05,
24, 32, 44.1, 48, 64, 88.2, 96 kHz
Applications
•
2.1 Channel Smartphone/iPOD docking systems
Part Number
CX20705
Description
Speakers-on-a-Chip with On-chip
Audio DSP Integrated I2S/I2C/USB
,
Codec, and Class-D Amplifier
• 2.1 Channel All-in-One PC speaker
CONEXANT [ CONEXANT SYSTEMS, INC ]
