2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630-851-4722
Fax: 630-851-5040
www.conwin.com
Package Characteristics
Design Recommendations
Table 14.0
Table 15.0
Package
Ceramic Surface Mount Package.
Vcc, should have
a large copper
area for reduced
Environmental Characteristics
0.010”(0.254mm)
Recommended
clearance
50 Ohm trace
<1”by design
Vcc
inductance.
Connect a 0.01uF
bypass capacitor
<0.1”(2.54mm)
from the pad.
Vibration:
Shock:
Soldering:
Vibration per Mil Std 883E Method 2007.3 Test Condition A
Mechanical Shock per Mil Std 883E Method 2002.4 Test Condition B.
SMD product suitable for Convection Reflow soldering. Peak
temperature 260 C. Maximum time above 220 C, 60 seconds.
Solderability per Mil Std 883E Method 2003
inductance
for internal
copper flood.
8
1
6
3
5
9
Buffer
Solderability
4
10
Ground
Ground,
should have
Suggested Pad Layout
Ground
Top View
Top View
a large copper
area for reduced
inductance.
0.295
(7.49mm)
0.051
(1.28mm)
0.030
(0.76mm)
50 Ohm Trace
Without
Vias
OSC
Output
Buffer
0.037
(0.94mm)
TOP LAYER
Keep Out Area
Top View
GROUND LAYER
0.215
(5.46mm)
0.051
(1.28mm)
1
BOTTOM LAYER
Dimensional Tolerance:
.005 (.127mm)
.02 (.508mm)
Typical Phase Noise
Solder Profile
Model T504-019.44MHz
Temperature
260°C
260°C
220°C
180°C
150°C
120°C
0
Time
120 S
10 S
Max.
60 S
Max.
360 Sec. Max.
LVCMOS Output Waveform
90%
50%
10%
Tape and Reel Specifications
Clipped Sinewave Output Waveform
0
1
200 mV/Div
US Headquarters:
630-851-4722
European Headquarters:
+353-61-472221
Bulletin
Page
Tx176
4 of 4
07
Revision
Date
25 Aug 2008
Specifications subject to change without notice. All dimensions in inches. © Copyright 2008 The Connor-Winfield Corporation
CONNOR-WINFIELD [ CONNOR-WINFIELD CORPORATION ]
