2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630-851-4722
Fax: 630-851-5040
www.conwin.com
Design Recommendations
Vcc, should have
a large copper
area for reduced
inductance.
Connect a 0.01uF
bypass capacitor
<0.1”(2.54mm)
from the pad.
Package Characteristics
Package
Ceramic Surface Mount Package.
Table 14.0
8
9
6
5
0.010”(0.254mm)
Recommended
clearance
inductance
for internal
copper flood.
Ground,
should have
a large copper
area for reduced
inductance.
Vcc
50 Ohm trace
<1”by design
Buffer
Environmental Characteristics
Vibration:
Shock:
Soldering:
Solderability
Table 15.0
Vibration per Mil Std 883E Method 2007.3 Test Condition A
Mechanical Shock per Mil Std 883E Method 2002.4 Test Condition B.
SMD product suitable for Convection Reflow soldering. Peak
temperature 260 C. Maximum time above 220 C, 60 seconds.
Solderability per Mil Std 883E Method 2003
10
1
3
4
Ground
Top View
Ground
Top View
Suggested Pad Layout
0.295
(7.49mm)
0.051
(1.28mm)
OSC
TOP LAYER
GROUND LAYER
50 Ohm Trace
Without Output
Vias
Buffer
0.030
(0.76mm)
0.037
(0.94mm)
0.215
(5.46mm)
Top View
1
Dimensional Tolerance:
±.005 (.127mm)
±.02 (.508mm)
Keep Out Area
.......
BOTTOM LAYER
0.051
(1.28mm)
Typical Phase Noise
Model T504-019.44MHz
Solder Profile
Temperature
260°C
220°C
180°C
150°C
120°C
260°C
0
120 S
Max.
Time
10 S
60 S
Max.
360 Sec. Max.
LVCMOS Output Waveform
90%
50%
10%
Tape and Reel Specifications
Clipped Sinewave Output Waveform
0
1
200 mV/Div
US Headquarters:
630-851-4722
European Headquarters:
+353-61-472221
Bulletin
Page
Revision
Date
Specifications subject to change without notice. All dimensions in inches. © Copyright 2008 The Connor-Winfield Corporation
Tx176
4 of 4
07
25 Aug 2008
CONNOR-WINFIELD [ CONNOR-WINFIELD CORPORATION ]
