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FP0705R1-R10-R 参数 Datasheet PDF下载

FP0705R1-R10-R图片预览
型号: FP0705R1-R10-R
PDF下载: 下载PDF文件 查看货源
内容描述: 大电流,小尺寸功率电感 [High Current, Low-Profile Power Inductors]
分类和应用:
文件页数/大小: 4 页 / 430 K
品牌: COOPER [ COOPER BUSSMANN, INC. ]
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Solder Reflow Profile  
TP  
TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))  
cc  
TC -5°C  
tP  
Max. Ramp Up Rate = 3°C/s  
Max. Ramp Down Rate = 6°C/s  
Volume  
Volume  
Package  
Thickness  
<2.5mm  
mm3  
mm3  
_
<350  
235°C  
220°C  
>350  
TL  
220°C  
220°C  
Preheat  
t
_
>2.5mm  
Tsmax  
TTaabbllee 22 - LLeeaadd ((PPbb)) FFrreee SSoolldeerr ((TT ))  
cc  
Volume  
Volume  
Volume  
mm3  
>2000  
26C  
245°C  
245°C  
Tsmin  
mm3  
mm3  
ts  
Package  
Thickness  
<1.6mm  
<350  
26C  
1.6 – 2.5mm 26C  
>2.5mm 250°C  
350 - 2000  
26C  
250°C  
245°C  
25°C  
Time 25°C to Peak  
Time  
Reference JDEC J-STD-020D  
Profile Feature  
Standard SnPb Solder Lead (Pb) Free Solder  
100°C  
Preheat and Soak  
• Temperature min. (T  
)
150°C  
smin  
• Temperature max. (T  
)
150°C  
200°C  
smax  
) (t )  
• Time (T  
smin  
to T  
60-120 Seconds  
C/ Second Max.  
60-120 Seconds  
C/ Second Max.  
smax s  
Average ramp up rate T  
to T  
smax  
p
Liquidous temperature (T  
Time at liquidous (t )  
L
)
183°C  
60-150 Seconds  
217°C  
60-150 Seconds  
L
Peak package body temperature (T )*  
Table 1  
Table 2  
P
Time (t )** within 5 °C of the specified classification temperature (T )  
20 Seconds**  
6°C/ Second Max.  
6 Minutes Max.  
30 Seconds**  
6°C/ Second Max.  
8 Minutes Max.  
p
Average ramp-down rate (T to T  
c
)
smax  
p
Time 25°C to Peak Temperature  
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.  
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.  
p
North America  
Europe  
Asia Pacific  
Cooper Electronic Technologies  
1225 Broken Sound Parkway NW  
Suite F  
Cooper Bussmann  
Cooper Electronic Technologies  
Cooper (UK) Limited  
Cooper Electronic Technologies  
1 Jalan Kilang Timor  
#06-01 Pacific Tech Centre  
Singapore 159303  
Cooper Electronic Technologies  
Avda. Santa Eulalia, 290  
08223  
P.O. Box 14460  
St. Louis, MO 63178-4460  
Tel: 1-636-394-2877  
Fax: 1-636-527-1607  
Burton-on-the-Wolds  
Boca Raton, FL 33487-3533  
Tel: 1-561-998-4100  
Fax: 1-561-241-6640  
Toll Free: 1-888-414-2645  
Leicestershire • LE12 5TH UK  
Tel: +44 (0) 1509 882 737  
Fax: +44 (0) 1509 882 786  
Terrassa, (Barcelona), Spain  
Tel: +34 937 362 812  
+34 937 362 813  
Tel: +65 278 6151  
Fax: +65 270 4160  
Fax: +34 937 362 719  
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This  
bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, with-  
out notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any  
technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.  
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company.  
Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably  
expected to result in significant injury to the user.  
© 2008 Cooper Bussmann  
St. Louis, MO 63178  
www.cooperbussmann.com  
05-05-08 BU-SB08210  
Page 4 of 4  
Data Sheet: 4325