High Current, High Frequency, Low-Profile Power Inductors
FLAT-PAC™ FP0805 Series
Applications
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Multi-phase regulators
Voltage Regulator Module (VRM)
Point-of-load modules
Desktop and server VRM’s and EVRD’s
Data networking and storage systems
Notebook regulators
Graphics cards and battery power systems
DCR sensing
Environmental Data
SMD Device
Description
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Halogen free
125°C maximum total temperature operation
7.5 x 7.6 x 5mm surface mount package
Ferrite core material
High current carrying capacity, Low core losses
Controlled DCR tolerance for sensing circuits
Inductance range from 32nH to 200nH
Current range from 20 to 110 Amps
Frequency range up to 2MHz
RoHS compliant
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C (Range is application
specific)
• Solder reflow temperature: J-STD-020D compliant
Packaging
• Supplied in tape and reel packaging, 950 parts per reel,
13 inch diameter reel.
Product Specifications
Part Number
7
OCL ± 10% (nH) FLL Min. (nH)
32
58
72
100
200
23
42
52
72
144
1
2
FP0805R1-R03-R
FP0805R1-R06-R
FP0805R1-R07-R
FP0805R1-R10-R
FP0805R1-R20-R
Irms
3
(Amps) Isat1
4
@ 25°C (Amps) Isat2
5
@ 125°C (Amps) DCR (mΩ) @ 20°C K-factor
6
110
95
823.6
83
61
823.6
65
67
49
0.17 ± 17%
823.6
50
35
823.6
20
16
823.6
4 Isat1: Peak current for approximately 20% rolloff at +25°C.
5 Isat2: Peak current for approximately 20% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L *
ΔI
* 10-3, Bp-p : (Gauss),
K: (K-factor from table), L: (inductance in nH),
ΔI
(peak-to-peak ripple current in amps).
7 Part Number Definition: FP0805Rx-Rxx-R
• FP0805 = Product code and size
• Rx is the DCR indicator
• Rxx= Inductance value in
μH,
R = decimal point • “-R” suffix = RoHS compliant
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
1208
BU-SB08859
Page 1 of 4
Data Sheet: 4340
COOPER [ COOPER BUSSMANN, INC. ]
