High Current, High Frequency, Power Inductors
FLAT-PAC™ FP1109 Series
Applications:
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Multi-phase regulators
Voltage Regulator Module (VRM)
Desktop and server VRMs and EVRDs
Data networking and storage systems
Notebook regulators
Graphics cards and battery power systems
Point-of-load modules
DCR sensing
Environmental Data:
SMD Device
Description:
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Halogen free
125°C maximum total temperature operation
11.2 x 11.2 x 9.0mm surface mount package
Ferrite core material
High current carrying capacity, low core losses
Controlled DCR tolerance for sensing circuits
Inductance range from 205nH to 950nH
Current range from 11.5 to 69 amps
Frequency range up to 2MHz
RoHS compliant
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(Range is application specific)
• Solder reflow temperature: J-STD-020D compliant
Packaging:
• Supplied in tape and reel packaging, 350 parts per reel,
13” diameter reel
Product Specifications
Part Number
7
OCL ± 10% (nH) FLL Min. (nH)
205
247
270
311
463
548
950
122
147
160
185
275
325
565
1
2
FP1109-R20-R
FP1109-R23-R
FP1109-R27-R
FP1109-R33-R
FP1109-R47-R
FP1109-R58-R
FP1109-1R0-R
Irms
3
(Amps) Isat1
4
@ 25°C (Amps) Isat2
5
@ 125°C (Amps) DCR (mΩ) @ 20°C K-factor
6
69
52
233
55
41
233
51
38
233
35
44
33
0.42 ±10%
233
27
20
233
22.5
17
233
11.5
8.5
233
4 Isat1: Peak current for approximately 30% rolloff at +25°C.
5 Isat2: Peak current for approximately 30% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L *
ΔI
* 10-3, Bp-p : (Gauss),
K: (K-factor from table), L: (inductance in nH),
ΔI
(peak-to-peak ripple current in amps).
7 Part Number Definition: FP1109-xxx-R
• FP1109 = Product code and size
• xxx= Inductance value in
μH,
R = decimal point. If no “R” is present, then
third character = # of zeros
• “-R” suffix = RoHS compliant
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
1108
BU-SB08800
Page 1 of 4
Data Sheet: 4350
COOPER [ COOPER BUSSMANN, INC. ]
