CASE K
C
ASES
Dot on top of case indicates pin one
CASE K
BOTTOM VIEW
See Figures 42 - 48
for pin configuration
1.125 max
(28.58)
2.910 max
(73.91)
Flange Thickness:
Cases K1, K2, K3 and MLP Series (K5)
0.060 (1.52)
Cases K4, K5 (except MLP Series), K6, K7, and K8
0.067 +0.005/-0.007 (1.70 +0.13/-0.8)
Materials
Header Case K1 - K3
Cold Rolled Steel/Nickel/Gold
Cases K4 - K8
Cold Rolled Steel/Nickel/Tin
Cover Case K1 - K3
Kovar/Nickel
Case K4 - K8
Cold Rolled Steel/Nickel/Tin
Pins
#52 alloy (all cases)
Case K1, K2, and K3 (except MHV Series Single and Dual)
ceramic seal
Cases K4 - K8 and MHV Series Single and Dual (K3)
compression glass seal
Case dimensions in inches (mm)
Tolerance
±0.005
(0.13) for three decimal places
±0.01
(0.2) for two decimal places
unless otherwise specified
CAUTION
Heat from reflow or wave soldering may damage
the device. Solder pins individually with heat
application not exceeding 300°C for 10 seconds
per pin.
F
IGURE
41: C
ASE
K M
AXIMUM
D
IMENSIONS
B8-26
CRANE [ Crane Aerospace & Electronics. ]
