Maximum Ratings at T
A
= 25°C
Notes 1&3
DC Forward Current
Note 4
Peak Forward Current (1/10 duty cycle @ 1 kHz)
LED Junction Temperature
Reverse Voltage
Operating Temperature Range
Storage Temperature Range
Electrostatic Discharge Threshold (HBM)
Note 2
Electrostatic Discharge Classification (MIL-STD-883E)
Note 2
Typical Electrical/Optical Characteristics at T
A
= 25°C, If = 120 mA
Part Number
Forward Voltage (V
f
, V)
Min.
C450TR5050M-Sxx000
Mechanical Specifications
Description
P-N Junction Area (μm)
Chip Area (μm)
Chip Thickness (μm)
Au Bond Pad Diameter Anode (μm)
Au Bond Pad Thicknesses (μm)
Au Bond Pad Diamater Cathode (μm)
2.7
Typ.
3.3
Max.
3.5
Note 3
CxxxTR5050M-Sxx000
200 mA
250 mA
150°C
5 V
-40°C to +100°C
-40°C to +100°C
1000 V
Class 2
Reverse Current
[I(Vr=5V), μA]
Max.
2
Full Width Half Max
(λ
D
, nm)
Typ.
20
CxxxTR5050M-Sxx000
Dimension
426 x 443
500 x 500
175
90
1.0
98
Tolerance
±35
±35
±15
±10
±0.5
±10
±25
±45
±1.0
Notes:
1.
Max If (mA)
Bottom Area (μm)
Max Vf @Max If (V)
Bottom Contact Metal Thickness (μm)
Max Tj (Deg C)
Max Power (W)
Bottom Contact Metal (um)
200
3.5
150
0.7
288 x 288
320 x 320
3.0
2.
3.
4.
Maximum ratings are package-dependent. The
(C/W)
ratings
10
were determined using lamps in chip-on-MCPCB (metal core PCB) packages for
Thermal Resistance
above
20
30
characterization. Ratings for other packages may differ. Junction temperature should be characterized in a specific package to determine limitations.
Assembly processing temperature must not exceed 325°C (< 5 seconds).
Rth (
j-A)
=
If @ Tamb
Tamb
Tamb
Product resistance to electrostatic discharge (ESD) according to the HBM is measured by simulating ESD using a rapid avalanche energy test (RAET).
200
25
25
25
The RAET procedures are designed to approximate the maximum ESD ratings shown.
200
143
136
129
All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled and operated at 120
0
150
150
150
mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given are within the range of average values
expected by manufacturer in large quantities and are provided for information only. All measurements were made using lamps in T-1 3/4 packages
(with Hysol OS4000 epoxy encapsulant and clear epoxy die attach). Optical characteristics measured in an integrating sphere using Illuminance E.
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end-product to be
designed in a manner that minimizes the thermal resistance from the LED junction to ambient in order to optimize product performance.
250
Maximum Forward Current (mA)
200
150
100
50
Rth
j-a
= 10
Rth
j-a
= 20
Rth
j-a
= 30
Rth
j-a
= 40
C/W
C/W
C/W
C/W
0
50
75
100
125
150
175
Ambient Temperature (C)
Copyright © 2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the
Cree logo are registered trademarks, and TM and TR5050M are trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com
2
CPR3EX Rev. -
CREE [ CREE, INC ]
