Direct Attach DA1000™ LEDs
CxxxDA1000-Sxx000
Data Sheet
Cree’s Direct Attach DA1000 LEDs are the next generation of solid-state LED emitters that combine highly efficient
InGaN materials with Cree’s proprietary device technology and silicon-carbide substrates to deliver superior value for
the general-illumination market. The DA1000 LEDs are among the brightest in the lighting market while delivering
a low forward voltage, resulting in a very bright and highly efficient solution. The bondpad-down design allows for
a eutectic direct die-attach process, eliminating the need for wire bonds, and enables superior performance from
improved thermal management.
FEATURES
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Direct Attach LED Technology
Rectangular LED RF Performance
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450 & 460 nm – 485 mW min
High Reliability - Eutectic Attach
Low Forward Voltage (Vf) – 3.15 V Typical at 350 mA
Maximum DC Forward Current – 1000 mA
InGaN Junction-Down Design for Improved Thermal
Management
No Wire Bonds Required
APPLICATIONS
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General Illumination
− Aircraft
− Decorative Lighting
− Task Lighting
− Outdoor Illumination
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White LEDs
Camera Flash
Projection Displays
Automotive
CxxxDA1000-Sxx000 Chip Diagram
Top View
Die Cross Section
Bottom View
A
CPR3ES Rev
Data Sheet:
DA1000 LED
1000 x 1000 μm
Anode (+)
945 x 75 μm
Gap 75 μm
Cathode (-)
945 x 795 μm
t = 335 μm
Subject to change without notice.
www.cree.com
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CREE [ CREE, INC ]
