Cree
®
EZ000™ LEDs
Data Sheet
CxxxEZ000-Sxx000
Cree’s EZBright™ LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN
materials with Cree’s proprietary optical design and device submount technology to deliver superior value for high-
intensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern.
Additionally, these LEDs are die-attachable with conductive epoxy, solder paste or solder preforms, as well as the flux
eutectic method. These vertically structured, low forward voltage LED chips are approximately 100 microns in height.
Cree’s EZ™ chips are tested for conformity to optical and electrical specifications. These LEDs are useful in a broad
range of applications such as general illumination, automotive lighting, and LCD backlighting.
FEATURES
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EZBright LED Technology
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200 mW min. - 450, 460 & 470 nm
300 mW min. - 450, 460 & 470 nm
80 mW min. - 527 nm
130 mW min. - 527 nm
APPLICATIONS
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General Illumination
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Aircraft
Decorative Lighting
Task Lighting
Outdoor Illumination
Lambertian Radiation
Conductive Epoxy, Solder Paste or Preforms, or Flux
Eutectic Attach
Thin 100
μm Chip
Low Forward Voltage
White LEDs
LCD Backlighting
Projection Displays
Automotive
CxxxEZ000-Sxx000 Chip Diagram
Top View
EZBright LED
980 x 980
μm
2
Bottom View
Die Cross Section
.A
CPR3CR Rev
Data Sheet:
Cathodes (-)
130 x 130
μm
2
t = 100
μm
Backside Metalization
Anode (+)
3
μm AuSn
Gold Bond Pads (2)
Subject to change without notice.
www.cree.com
CREE [ CREE, INC ]
