CxxxTR5270-Sxx00-3 (250-µm) Chip Diagram
Top View
Die Cross Section
Bottom View
Cathode (-)
98-μm diameter
TR5270 LED
520 x 700 μm
Anode (+)
90-μm diameter
Bottom Surface
260 x 440 μm
t = 250 μm
Mechanical Specifications
Description
P-N Junction Area (μm)
Chip Area (μm)
Chip Thickness (μm)
Au Bond Pad Diameter Anode (μm)
Au Bond Pad Thicknesses (μm)
Au Bond Pad Diameter Cathode (μm)
Bottom Area (μm)
CxxxTR5270-Sxx00
(175-µm)
Dimension
450 x 640
520 x 700
175
90
1.0
98
347 x 527
Tolerance
±35
±35
±15
±10
±0.5
±10
±35
Mechanical Specifications
Description
P-N Junction Area (μm)
Chip Area (μm)
Chip Thickness (μm)
Au Bond Pad Diameter Anode (μm)
Au Bond Pad Thicknesses (μm)
Au Bond Pad Diameter Cathode (μm)
Bottom Area (μm)
CxxxTR5270-Sxx00-3
(250-µm)
Dimension
450 x 640
520 x 700
250
90
1.0
98
260 x 440
Tolerance
±35
±35
±15
±10
±0.5
±10
±45
Copyright © 2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the
Cree logo are registered trademarks, and TR and TR5270 are trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com
2
CPR3ET Rev. -
CREE [ CREE, INC ]
