Maximum Ratings at T
A
= 25°C
Notes 1&3
DC Forward Current
Peak Forward Current (1/10 duty cycle @ 1 kHz)
LED Junction Temperature
Reverse Voltage
Operating Temperature Range
Storage Temperature Range
Electrostatic Discharge Threshold (HBM)
Note 2
Electrostatic Discharge Classification (MIL-STD-883E)
Note 2
Typical Electrical/Optical Characteristics at T
A
= 25°C, If = 5 mA
Part Number
Forward Voltage (V
f
, V)
Min.
C450UT190-Sxxxx-30
C460UT190-Sxxxx-30
C470UT190-Sxxxx-30
C527UT190-Sxxxx-30
Mechanical Specifications
Description
P-N Junction Area (μm)
Chip Top Area (μm)
Chip Bottom Area (μm)
Chip Thickness (μm)
Au Bond Pad Diameter (μm)
Au Bond Pad Thickness (μm)
Backside Contact Metal Area (μm)
2.7
2.7
2.7
2.7
Typ.
2.9
2.9
2.9
3.0
Max.
3.1
3.1
3.1
3.2
Note 3
CxxxUT190-Sxxxx-30
30 mA
100 mA
125°C
5 V
-40°C to +100°C
-40°C to +100°C
1000 V
Class 2
Reverse Current
[I(Vr=5 V), μA]
Max.
2
2
2
2
Full Width Half Max
(λ
D
, nm)
Typ.
21
21
22
35
CxxxUT190-Sxxxx-30
Dimension
160 x 160
190 x 190
105 x 105
85
85
1.2
80 x 80
Tolerance
± 25
± 25
± 25
± 10
-10/+15
± 0.5
± 25
1. Maximum ratings are package dependent. The above ratings were determined using a T-1 3/4 package (with Hysol OS4000
epoxy) for characterization. Ratings for other packages may differ. The forward currents (DC and Peak) are not limited by the die
but by the effect of the LED junction temperature on the package. The junction temperature limit of 125°C is a limit of the T-1
3/4 package; junction temperature should be characterized in a specific package to determine limitations. Assembly processing
temperature must not exceed 325°C (< 5 seconds).
2. Product resistance to electrostatic discharge (ESD) according to the HBM is measured by simulating ESD using a rapid avalanche
energy test (RAET). The RAET procedures are designed to approximate the minimum ESD ratings shown. The ESD classification of
Class 2 is based on sample testing according to MIL-STD-883E.
3. All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled
and operated at 5 mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given
are within the range of average values expected by manufacturer in large quantities and are provided for information only. All
measurements were made using lamps in T-1 3/4 packages (with Hysol OS4000 epoxy). Optical characteristics measured in an
integrating sphere using Illuminance E.
4. Caution: To obtain optimum output efficiency, the amount of epoxy used should be characterized based upon the specific
application.
Notes:
Copyright © 2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the
Cree logo and G•SiC are registered trademarks, and UltraThin and UT are trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com
2
CPR3EO Rev. A
CREE [ CREE, INC ]
