Direct Attach DA3547™ LEDs
CxxxDA3547-Sxxx00
Data Sheet
Cree’s Direct Attach DA3547 LEDs are the next generation of solid-state LED emitters that combine highly efficient
InGaN materials with Cree’s proprietary device technology and silicon-carbide substrates to deliver superior value
for the TV-backlighting and general-illumination markets. The DA3547 LEDs are among the brightest in the top-view
market while delivering a low forward voltage, resulting in a very bright and highly efficient solution. The bondpad-
down design allows for eutectic die attach, eliminating the need for wire bonds, and enables superior performance
from improved thermal management. The design is optimally suited for industry-standard top-view packages.
FEATURES
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Rectangular LED RF Performance
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450 & 460 nm – 76 mW min
High Reliability - Eutectic Attach
Low Forward Voltage (Vf) – 3.1 V Typical at 50 mA
Maximum DC Forward Current – 150 mA
1000-V ESD Threshold Rating
InGaN Junction-Down Design for Improved Thermal
Management
No Wire Bonds Required
APPLICATIONS
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Large LCD Backlighting
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Television
General Illumination
Medium LCD Backlighting
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Portable PCs
Monitors
LED Video Displays
White LEDs
CxxxDA3547-Sxxx00 Chip Diagram
Top View
DA3547 LED
350 x 470 μm
Die Cross Section
Bottom View
.A
CPR3EL Rev
Data Sheet:
Anode (+)
296 x 90 μm
Gap 90 μm
Cathode (-)
296 x 236 μm
t = 155 μm
Subject to change without notice.
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CREE [ CREE, INC ]
