Maximum Ratings at T
A
= 25°C
Notes 1, 2 & 3
DC Forward Current
Peak Forward Current (1/10 duty cycle @ 1 kHz)
LED Junction Temperature
Reverse Voltage
Operating Temperature Range
Storage Temperature Range
Typical Electrical/Optical Characteristics at T
A
= 25°C, If = 350 mA
Part Number
Forward Voltage (V
f
, V)
Min.
C450DA700-Sxx000
C460DA700-Sxx000
Mechanical Specifications
Description
P-N Junction Area (μm)
Chip Bottom Area (μm)
Chip Top Area (μm)
Chip Thickness (μm)
AuSn Bond Pad Width – Anode (um)
AuSn Bond Pad Length – Anode (um)
AuSn Bond Pad Width – Cathode (um)
AuSn Bond Pad Length – Cathode (um)
Bond Pad Gap (μm)
AuSn Bond Pad Thickness (μm)
2.9
2.9
Typ.
3.3
3.3
Max.
3.5
3.5
Note 2
CxxxDA700-Sxx000
750 mA
1000 mA
150°C
5 V
-40°C to +100°C
-40°C to +100°C
Reverse Current
[I(Vr=5V), μA]
Max.
2
2
Full Width Half Max
(λ
D
, nm)
Typ.
20
21
CxxxDA700-Sxx000
Dimension
645 x 645
700 x 700
340 x 340
335
75
645
495
645
75
3
Tolerance
±35
±35
±35
±25
±15
±35
±35
±35
±15
±0.5
Notes:
1.
2.
3.
Maximum ratings are package-dependent. The above ratings were determined using a Cree 3.45-mm x 3.45-mm SMT package (with silicone
encapsulation and intrinsic AuSn metal die attach) for characterization. Ratings for other packages may differ. Junction temperature should be
characterized in a specific package to determine limitations. Assembly processing temperature must not exceed 325°C (< 5 seconds).
All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled and operated at 350
mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given are within the range of average values
expected by manufacturer in large quantities and are provided for information only. All measurements were made using lamps in T-1¾ packages (with
Hysol OS4000 epoxy encapsulant and intrinsic AuSn metal die attach). Optical characteristics measured in an integrating sphere using Illuminance E.
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end-product to be
designed in a manner that minimizes the thermal resistance from the LED junction to ambient in order to optimize product performance.
800
700
Maximum Forward Current (mA)
600
500
400
300
200
100
0
25
50
75
100
125
150
175
Rth
j-a
= 10
Rth
j-a
= 15
Rth
j-a
= 20
Rth
j-a
= 25
C/W
C/W
C/W
C/W
Ambient Temperature (C)
Copyright © 2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the
Cree logo are registered trademarks, and DA and DA700 are trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com
2
CPR3EU Rev. -
CREE [ CREE, INC ]
