Cree
®
EZ1400™ Gen II LEDs
Data Sheet
CxxxEZ1400-Sxx000-2
Cree’s EZBright™ LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN
materials with Cree’s proprietary optical design and device submount technology to deliver superior value for high-
intensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern.
Additionally, these LEDs are die-attachable with conductive epoxy, solder paste or solder preforms, as well as the flux
eutectic method. These vertically structured, low forward voltage LED chips are approximately 170 microns in height.
Cree’s EZ™ chips are tested for conformity to optical and electrical specifications. These LEDs are useful in a broad
range of applications such as general illumination, automotive lighting, projection displays and camera flash.
FEATURES
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EZBright LED Technology
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800 mW min. @ 1000 mA - 450 & 460 nm
Lambertian Radiation
Conductive Epoxy, Solder Paste or Preforms, or Flux
Eutectic Attach
Low Forward Voltage
APPLICATIONS
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General Illumination
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Aircraft
Decorative Lighting
Task Lighting
Outdoor Illumination
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Dielectric Passivation across Epi Surface
White LEDs
Projection Displays
Automotive
Camera Flash
CxxxEZ1400-Sxx000-2 Chip Diagram
Top View
Die Cross Section
1380 x 1380 μm
Anode (+)
AuSn
Bottom View
.-
CPR3EK Rev
Data Sheet:
Mesa (Junction)
1350 x 1350 μm
Thickness
170
μm
Cathodes (-)
150 x 150 μm
Subject to change without notice.
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