xlamp mC-e leds
characteristics - comPlete PackaGe
The following table lists the product characteristics for the XLamp mC-e LeD package.
characteristics
Thermal Resistance, junction to solder point - white
Thermal Resistance, junction to solder point - color
viewing angle (FwHm) - white
viewing angle (FwHm) - color
ESD Classification (HBM per Mil-Std-883D)
LED Junction Temperature
°C
unit
°C/w
°C/w
degrees
degrees
minimum
typical
3
4
110
115
Class 2
150
maximum
characteristics - Per led die (White, easyWhite, dynamic White)
The following table lists the product characteristics of each individual LeD die within the XLamp mC-e white LeD package.
characteristics
Temperature Coefficient of Voltage
DC Forward Current
Reverse voltage
Forward voltage (@ 350 ma)
Forward voltage (@ 700 ma)
unit
mv/°C
ma
v
v
v
3.2
3.4
minimum
typical
-4
700
5
3.9
maximum
characteristics - Per led die (color)
The following table lists the product characteristics for each LeD die within the XLamp mC-e Color LeD package.
characteristics
Temperature Coefficient of Voltage
DC Forward Current
Reverse voltage
Forward voltage (@ 350 ma)
Forward voltage (@ 700 ma)
unit
mv/°C
ma
v
v
v
Typ.
max.
max.
Typ.
max.
Typ.
red
-2
700
5
2.1
2.5
2.3
Green
-4
700
5
3.4
3.9
3.7
blue
-4
700
5
3.2
3.9
3.5
White
-4
700
5
3.2
3.9
3.5
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
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CREE [ CREE, INC ]
