Preliminary
July 1, 2010
Reflow Soldering Characteristics
In testing, Cree has found XLamp MX-3 LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the
manufacturer of solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
Profile Feature
Average Ramp-Up Rate (Ts
max
to Tp)
Preheat: Temperature Min (Ts
min
)
Preheat: Temperature Max (Ts
max
)
Preheat: Time (ts
min
to ts
max
)
Time Maintained Above: Temperature (T
L
)
Time Maintained Above: Time (t
L
)
Peak/Classification Temperature (Tp)
Time Within 5°C of Actual Peak Temperature (tp)
Ramp-Down Rate
Time 25°C to Peak Temperature
Lead-Based Solder
3°C/second max.
100°C
150°C
60-120 seconds
183°C
60-150 seconds
215°C
10-30 seconds
6°C/second max.
6 minutes max.
Lead-Free Solder
3°C/second max.
150°C
200°C
60-180 seconds
217°C
60-150 seconds
260°C
20-40 seconds
6°C/second max
8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
This is a preliminary, non-binding product specification provided for informational purposes only and is subject to change
without notice. This product is unreleased and is provided “as is” without warranty.
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice.
Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com/xlamp
6
CLD-DS28 preliminary
CREE [ CREE, INC ]
