Thermal Design
Thermal Design
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is
200
180
160
140
120
100
80
60
40
20
0
0
25
50
75
100
125
150
crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to
ambient in order to optimize lamp life and optical characteristics.
Maximum Current (mA)
Rj-a
Rj-a
Rj-a
Rj-a
=
=
=
=
15°C/W
20°C/W
25°C/W
30°C/W
Typical Spatial Radiation Pattern
Typical Spatial Distribution
Ambient Temperature (ºC)
120
Relative Luminous Intensity (%)
100
80
60
40
20
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
Angle (º)
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice.
Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com/xlamp
5
CLD-DS32 Rev 0
CREE [ CREE, INC ]
