Reflow Soldering Characteristics
In testing, Cree has found XLamp XP-G LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the
manufacturer of solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
Profile Feature
Lead-Based Solder
Lead-Free Solder
Average Ramp-Up Rate (Tsmax to Tp)
3°C/second max.
100°C
3°C/second max.
150°C
Preheat: Temperature Min (Tsmin
Preheat: Temperature Max (Tsmax
Preheat: Time (tsmin to tsmax
)
)
150°C
200°C
)
60-120 seconds
183°C
60-180 seconds
217°C
Time Maintained Above: Temperature (TL)
Time Maintained Above: Time (tL)
60-150 seconds
60-150 seconds
Peak/Classification Temperature (Tp)
215°C
260°C
Time Within 5°C of Actual Peak Temperature (tp)
Ramp-Down Rate
10-30 seconds
6°C/second max.
6 minutes max.
20-40 seconds
6°C/second max
8 minutes max.
Time 25°C to Peak Temperature
Note: All temperatures refer to topside of the package, measured on the package body surface.
Copyright © 2009-2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree,
the Cree logo and XLamp are registered trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com/xlamp
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CLD-DS20 Rev 3
CREE [ CREE, INC ]
