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XPGWHT-L1-0000-00H51 参数 Datasheet PDF下载

XPGWHT-L1-0000-00H51图片预览
型号: XPGWHT-L1-0000-00H51
PDF下载: 下载PDF文件 查看货源
内容描述: Cree® XLamp® XP -G LED灯 [Cree® XLamp® XP-G LEDs]
分类和应用: 可见光LED光电
文件页数/大小: 10 页 / 996 K
品牌: CREE [ CREE, INC ]
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Cree
®
XLamp
®
XP-G LEDs
Data Sheet
The XLamp XP-G LED delivers unprecedented levels of light output and efficacy for a
single die LED. The XLamp XP-G LED continues Cree’s history of innovation in LEDs for
lighting applications with wide viewing angle, symmetrical package, unlimited floor life
and electrically neutral thermal path.
XLamp XP-G LEDs are the ideal choice for lighting applications where high light output
and maximum efficacy are required, such as LED light bulbs, outdoor lighting, portable
lighting, indoor lighting and solar-powered lighting.
FEATURES
Available in white and outdoor white
ANSI-compatible chromaticity bins
Maximum drive current: 1500 mA
Low thermal resistance: 6°C/W
Wide viewing angle: 125°
Unlimited floor life at ≤ 30ºC/85% RH
Reflow solderable - JEDEC J-STD-020C
Electrically neutral thermal path
RoHS and REACH-compliant
UL-recognized component (E326295)
Table of Contents
Flux Characteristics (T
J
= 25°C)................................................................................................................. 2
Characteristics ........................................................................................................................................ 2
Relative Spectral Power Distribution ........................................................................................................... 3
Relative Flux vs. Junction Temperature (I
F
= 350 mA)................................................................................... 3
Electrical Characteristics (T
J
= 25°C) .......................................................................................................... 4
Thermal Design ....................................................................................................................................... 4
Relative Flux vs. Current (T
J
= 25°C) ......................................................................................................... 5
Typical Spatial Distribution ........................................................................................................................ 5
Reflow Soldering Characteristics ................................................................................................................ 6
Notes ..................................................................................................................................................... 7
Mechanical Dimensions (T
A
= 25°C) ........................................................................................................... 8
Tape and Reel ......................................................................................................................................... 9
Packaging ............................................................................................................................................. 10
ev 3
CLD-DS20 R
Data Sheet:
Subject to change without notice.
www.cree.com/xlamp
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