Series HP1
Technical
METAL CASE, CASE-MOUNTED
SEMICONDUCTORS
HP1 Series for Single TO-3 or Stud Mount Devices
DESCRIPTION OF CURVES
A. N.C. Horiz. Device
Only Mounted to G-10.
A. N.C. Horiz. & Vert.
With Dissipator.
B. 200 RPM w/Diss.
C. 500 RPM w/Diss.
E. 1000 RPM w/Diss.
•
•
Thermal Resistance Case to Sink is 0.1-0.3
°C/W
w/Joint Compound.
Derate 1.0
°C/watt
for unplated part in natural convection only.
Ordering Information
Unplated
IERC PART NO.
Comm’l. Black
Anodize
HP1-000-CB
HP1-TO3-CB
HP1-TO3-33CB
HP1-TO3-44CB
HP1-436-CB
HP1-T06-CB
HP1-TO15-CB
HP1-420-CB
Mil. Black
Anodize
HP1-000-B
HP1-TO3-B
HP1-TO3-33B
HP1-TO3-44B
HP1-436-B
HP1-T06-B
HP1-TO15-B
HP1-420-B
Semiconductor
Accommodated
Hole patt.
Ref. No.
(see pg.
1-28)
--
16
17
31
18
19
23
27
Max. Weight
(Grams)
HP1-000-U
HP1-TO3-U
HP1-TO3-33U
HP1-TO3-44U
HP1-436-U
HP1-TO6-U
HP1-TO15-U
HP1-420-U
Undrilled
TO-3
TO-3 IC
TO-3 panel mount
TO-3 (4-pin)
TO-6, TO-36
TO-15, DO-5
Universal
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
CTS [ CTS CORPORATION ]
