BGA Routing Scheme
Recommended Land Pattern
Outline of Substrate
.010" Trace Width to
VTT Island
1.27 mm Pitch Package
RT2404B6
RT2402B6
.005 Inch
Wide Traces
Solder Mask Dia = Pad
Diameter +.15mm (.006 inch)
PCB Pad Diameter
1.00mm Pitch (B7) = 0.51mm/.020 inch (minimum)
1.27mm pitch (B6) = 0.64mm/.025 inch (minimum)
For .006" Thick Solder Paste Stencil, Aperture Opening Should
be Equal to the PCB Pad Diameter.
1.00 mm Pitch Package
.008" Trace Width to
VTT Island
RT2404B7
RT2402B7
Refer to www.ctscorp.com/components/clearone.asp for
additional PCB design information
.005 Inch
Wide Traces
Mechanical Diagrams
L
H
RT_40_B_
W
CTS YRWK
A1 Identifier
P (Pitch)
K
P (Pitch)
D
1.27mm Pitch
mm
L
W
H
P
D
K
11.43±0.15
.450±.006
L
3.81±0.15
.150±.006
W
1.32±0.15
.052±.006
H
1.27±0.25
.050±.010
P
0.76±0.05
.030±.002
D
0.64±0.25
.025±.010
K
Styles
H & F
inch
1.0mm Pitch
mm
9.00±0.15
.354±.006
3.00±0.15
.118±.006
1.19±0.15
.047±.006
1.00±0.25
.039±.010
0.64±0.05
.025±.002
0.50±0.25
.020±.010
Styles
H & F
inch
L
H
RT_40_B_
W
CTS YRWK
P (Pitch)
A1 Identifier
K
P (Pitch)
D
1.27mm Pitch
L
W
H
P
D
K
mm
11.43±0.15
.450±.006
L
5.08±0.15
.200±.006
W
1.32±0.15
.052±.006
H
1.27±0.25
.050±.010
P
0.76±0.05 0.64±0.25
.030±.002 .025±.010
Style C
inch
1.0mm Pitch
mm
D
K
9.00±0.15
.354±.006
4.00±0.15
.157±.006
1.19±0.15
.047±.006
1.00±0.25
.039±.010
0.64±0.05 0.50±0.25
.025±.002 .020±.010
Style C
inch
© 2006 CTS Corporation. All rights reserved. Information subject to change.
CTS Electronic Components
www.ctscorp.com
Page 2
July 06
DDR SDRAM Terminator
CTS [ CTS ]
