Recommended Land Pattern
Outline of Substrate
BGA Routing Scheme
RT2404B6
1.27 mm Pitch Package
RT2402B6
.010" Trace Width to
VTT Island
.005 Inch
Wide Traces
PCB Pad Diameter
1.00mm Pitch (B7) = 0.51mm/.020 inch (minimum)
1.27mm pitch (B6) = 0.64mm/.025 inch (minimum)
Solder Mask Dia = Pad
Diameter +.15mm (.006 inch)
For .006" Thick Solder Paste Stencil, Aperture Opening Should
be Equal to the PCB Pad Diameter.
Refer to
www.ctscorp.com/components/clearone.asp
for
additional PCB design information
RT2404B7
1.00 mm Pitch Package
RT2402B7
.008" Trace Width to
VTT Island
.005 Inch
Wide Traces
Mechanical Diagrams
L
H
W
RT_40_B_
CTS YRWK
A1 Identifier
P (Pitch)
P (Pitch)
D
K
1.27mm Pitch
mm
Styles
H&F
inch
1.0mm Pitch
mm
Styles
H&F
inch
L
11.43±0.15
.450±.006
L
9.00±0.15
.354±.006
W
3.81±0.15
.150±.006
W
3.00±0.15
.118±.006
H
1.32±0.15
.052±.006
H
1.19±0.15
.047±.006
P
1.27±0.25
.050±.010
P
1.00±0.25
.039±.010
D
0.76±0.05
.030±.002
D
0.64±0.05
.025±.002
K
0.64±0.25
.025±.010
K
0.50±0.25
.020±.010
L
H
W
RT_40_B_
CTS YRWK
P (Pitch)
A1 Identifier
K
P (Pitch)
D
1.27mm Pitch
mm
Style C
inch
1.0mm Pitch
mm
Style C
inch
L
11.43±0.15
.450±.006
L
9.00±0.15
.354±.006
W
5.08±0.15
.200±.006
W
4.00±0.15
.157±.006
H
1.32±0.15
.052±.006
H
1.19±0.15
.047±.006
P
1.27±0.25
.050±.010
P
1.00±0.25
.039±.010
D
0.76±0.05
.030±.002
D
0.64±0.05
.025±.002
K
0.64±0.25
.025±.010
K
0.50±0.25
.020±.010
CTS Electronic Components
www.ctscorp.com
© 2006 CTS Corporation. All rights reserved. Information subject to change.
Page 2
DDR SDRAM Terminator
July 06
CTS [ CTS CORPORATION ]
