rev.
page
date
1 of 2
07/2008
PART NUMBER:
CPM-2F
DESCRIPTION:
peltier cooling unit
CUI’s patented CPM-2 series cooling modules incorporate peltier
technology in a convenient package that maximizes heat absorp-
tion and reduces overall assembly cost. The CPM-2 is assem-
bled with our high performance peltier device between two preci-
sion-machined aluminum plates using thermally-conductive
adhesive, leading to better heat transfer between the cooling and
radiating surfaces. This module is perfect for applications such
as refrigeration, lasers, dehumidifiers, NEMA enclosures, or any
other electronic device that requires reliable, precision cooling.
specifications
max input voltage ¹
max current
max temp drop (ΔTmax)
max cooling power (Qmax)
dielectric strength
insulation resistance
internal resistance ²
cold plate temperature
storage temperature
operating temperature
storage humidity
operating humidity
weight
cooling medium
heat radiation medium
notes:
12 V dc
6A
73K (at Th=50° C)
46 W (at Th=Tc=50° C)
1200 V ac, 1 sec.
250 V dc, >10 M ohm
1.85 ~ 2.35 ohm
-20°C ~ +60° C
-20°C ~ +70° C
0°C ~ +35° C
10~90%
30~85%
200g
aluminum plate
aluminum plate
1. at inverse voltage “cold plate” becomes heat radiation plate
2. ambient temperature 25+/-1C, measured by 4 AC thermal method
performance graphs
20050
SW
112
th
Ave. Tualatin, Oregon
97062
phone
503.612.2300
fax
503.612.2383
CUI [ CUI INC ]
