Spec. No. : C754SA
Issued Date : 2006.07.13
Revised Date :
CYStech Electronics Corp.
Page No. : 3/3
SMA Dimension
Marking :
Device SK32 SK34 SK36 SK38
Code SK32 SK34 SK36 SK38
B
A
Device SK3B
Code SK3B
C
G
D
H
SMA/DO-214AC Plastic
E
F
Surface Mounted Package
CYStek Package Code : SA
*:Typical
Inches
Min. Max.
Millimeters
Inches
Min.
0.030
0.002
0.188
0.006
Millimeters
DIM
DIM
Min.
1.40
2.50
4.00
2.00
Max.
1.60
2.90
4.60
2.44
Max.
0.060
0.008
0.208
0.012
Min.
0.76
Max.
1.52
A
B
C
D
0.055
0.098
0.157
0.078
0.062
0.114
0.181
0.096
E
F
G
H
0.051
4.80
0.203
5.28
0.152
0.305
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SK3XSA
CYStek Product Specification