B1S THRU B10S
Features
· Glass Passivated Die Construction
· Diffused Junction
· Low Forward Voltage Drop, High Current Capability
· Surge Overload Rating to 30A Peak
· Designed for Printed Circuit Board Applications
· Plastic Material - UL Flammability Classification 94V-0
L
CURRENT 0.8 Amperes
VOLTAGE 100 to 1000 Volts
G
A B
D E
H
J
K
Dim
A
B
C
D
E
G
H
J
K
L
C
MiniDIP
Min
5.43
3.60
0.15
0.05
0.70
4.50
2.80
2.50
0.50
Max
5.75
4.00
0.35
0.20
7.00
1.10
4.90
2.90
2.70
0.80
Mechanical Data
· Case : Molded Plastic
· Terminals : Solder Plated Leads,
Solderable per MIL-STD-202, Method 2026
· Polarity : As Marked on Case
· Approx. Weight : 0.125 grams
· Mounting Position : Any
· Marking : Type Number
A ll Dimens ions in mm
Maximum Ratings And Electrical Characteristics
(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive
load. For capacitive load, derate by 20%)
Symbols
Peak Repetitive Reverse voltage
Working Peak Reverse voltage
DC Blocking voltage
RMS Reverse voltage
Average Rectified Output Current
@ T
A
=40
℃
V
RMM
V
RWM
V
R
V
RMS
Io
I
FSM
V
FM
I
RM
C
j
Rθ
JA
T
j
T
STG
B1S
100
70
B2S
200
140
B4S
400
280
0.8
30
1.0
10
500
10
75
B6S
600
420
B8S
800
560
B10S
1000
700
Units
Volts
Volts
Amp
Amp
Volts
μA
pF
℃/W
℃
Non-Repetitive Peak Forward Surge Current,
8.3ms single half-sine-wave superimposed
on rated load (JEDEC method)
Forward voltage (per element)
Peak Reverse Current at Rated
DC Blocking voltage (per element)
Typical Junction Capacitance
per element (Note 1)
Typical Thermal Resistance,
Junction to Ambient (Note 2)
Operating and Storage Temperature Range
@ I
F
=0.4 A
@ T
A
=25℃
@ T
A
=125℃
-55 to +150
Notes:
(1) Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC.
(2) Thermal Resistance, junction to ambient, measured on PC board with 5.0
2
mm (0.03mm thick) land areas.
DAESAN [ DAESAN ELECTRONICS CORP. ]
