KBP005 THRU KBP10
Features
· Glass Passivated Die Construction
· High Case Dielectric Strength of 1500V
RMS
· Low Reverse Leakage Current
· Surge Overload Rating to 40A Peak
· Ideal for Printed Circuit Board Applications
· Plastic Material - UL Flammability Classification 94V-0
A
CURRENT 2.0 Amperes
VOLTAGE 50 to 1000 Volts
B
+
H
-
C
KBP
Mechanical Data
· Case: Molded Plastic
· Terminals: Plated Leads, Solderable per
MIL-STD-202, Method 208
· Polarity: As Marked on Body
· Approx. Weight: 1.52 grams
· Mounting Position: Any
· Marking: Type Number
G
D
Dim
A
B
C
Min
14.00
10.50
15.00
4.70
3.50
2.30
Max
15.00
11.50
5.00
4.00
2.50
E
D
E
G
H
0.70 T ypical
A ll Dimens ions in mm
Maximum Ratings And Electrical Characteristics
(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive
load. For capacitive load, derate by 20%)
Symbols
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse voltage
Average Rectified Output Current
@ T
C
=105
℃
V
RMM
V
RWM
V
R
V
R(RMS)
Io
I
FSM
V
FM
I
RM
C
j
Rθ
JC
T
j
T
STG
KBP
005
50
35
KBP
01
100
70
KBP
02
200
140
KBP
04
400
280
2.0
40
1.1
5.0
500
20
30
-65 to +150
KBP
06
600
420
KBP
08
800
560
KBP
10
1000
700
Units
Volts
Volts
Amps
Amps
Volts
μA
pF
℃/W
℃
Non-Repetitive Peak Forward Surge Current,
8.3ms single half-sine-wave superimposed
on rated load per element (JEDEC method)
Forward Voltage (per element)
Peak Reverse Current at Rated
DC Blocking Voltage
@ I
F
=2.0 A
@ T
C
=25℃
@ T
C
=125℃
Typical Junction Capacitance (Note 1)
Typical Thermal Resistance,
Junction to Case (Note 2)
Operating and Storage Temperature Range
Notes:
(1) Thermal resistance from junction to case per element. Unit mounted on 300 x 300 x 16mm aluminum plate heat sink.
(2) Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC.
DAESAN [ DAESAN ELECTRONICS CORP. ]
