MD1S THRU MD7S
Features
· Glass Passivated Die Construction
· Diffused Junction
· Low Forward Voltage Drop, High Current Capability
· Surge Overload Rating to 30A Peak
· Designed for Printed Circuit Board Applications
· Plastic Material - UL Flammability Classification 94V-0
L
CURRENT 0.5 Amperes
VOLTAGE 50 to 1000 Volts
G
A B
D E
H
J
K
Dim
A
B
C
D
E
G
H
J
K
L
C
MiniDIP
Min
5.43
3.60
0.15
0.05
0.70
4.50
2.80
2.50
0.50
Max
5.75
4.00
0.35
0.20
7.00
1.10
4.90
2.90
2.70
0.80
Mechanical Data
· Case : Molded Plastic
· Terminals : Solder Plated Leads,
Solderable per MIL-STD-202, Method 2026
· Polarity : As Marked on Case
· Approx. Weight : 0.125 grams
· Mounting Position : Any
· Marking : Type Number
A ll Dimens ions in mm
Maximum Ratings And Electrical Characteristics
(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive
load. For capacitive load, derate by 20%)
Symbols
Peak Repetitive Reverse voltage
Working Peak Reverse voltage
DC Blocking voltage
RMS Reverse voltage
Maximum DC blocking voltage
Average Rectified Output Current
@ T
A
=40
℃
V
RMM
V
RWM
V
R
V
RMS
V
DC
Io
I
FSM
V
FM
I
RM
Rθ
JA
T
j
T
STG
MD1S MD2S MD3S MD4S MD5S MD6S MD7S
50
35
50
100
70
100
200
140
200
400
280
400
0.5
30
1.0
5.0
500
75
-55 to +150
600
420
600
800
560
800
1000
700
1000
Units
Volts
Volts
Volts
Amp
Amps
Volts
μA
℃/W
℃
Non-Repetitive Peak Forward Surge Current,
8.3ms single half-sine-wave superimposed
on rated load (JEDEC method)
Forward voltage (per element)
Peak Reverse Current at Rated
DC Blocking voltage (per element)
Typical Thermal Resistance,
Junction to Ambient (Note 2)
Operating and Storage Temperature Range
@ I
F
=0.4 A
@ T
A
=25℃
@ T
A
=100℃
Notes:
(1) Mounted on P.C. Board.
(2) Thermal resistance junction to ambient.
DAESAN [ DAESAN ELECTRONICS CORP. ]
