RS1A THRU RS1K
Features
· For surface mounted applications in order optimize
board space
· Low profile package
· Built-in strain relief, ideal for automated placement
· Fast switching speed
· Plastic package has Unerwrites Laboratory
Flammability Classification 94V-0
· Low forward voltage drop
· Glass passivated chip junction
· High temperature soldering : 250℃/10 seconds,
at terminals
CURRENT 1.0 Ampere
VOLTAGE 50 to 800 Volts
DO-214AC (SMA)
0.058(1.47)
0.052(1.32)
0.110(2.79)
0.100(2.54)
0.177(4.50)
0.157(3.99)
0.012(0.31)
0.006(0.15)
0.090(2.29)
0.078(1.98)
0.060(1.52)
0.030(0.76)
0.005(0.127)
MAX.
0.208(5.28)
0.194(4.93)
Mechanical Data
· Case : JEDEC SMA(DO-214AC) molded plastic body
· Terminals : Solder plated solderable per
MIL-STD-750, method 2026
· Polarity : Color band denotes cathode end
· Mounting Position : Any
· Weight : 0.002 ounce, 0.064 gram
Dimensions in inches and (millimeters)
Maximum Ratings And Electrical Characteristics
(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive
load. For capacitive load, derate by 20%)
Symbols
Maximum recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
L
=90℃
Peak forward surge current 8.3ms single
half sine-wave superimposed on rated load
(JEDEC method) at T
L
=90℃
Maximum instantaneous forward voltage
at 1.0A
Maximum DC reverse current T
A
=25℃
at rated DC blocking voltage T
A
=125℃
Maximum reverse recovery time (Note 1)
Typical thermal resistance (Note 3)
Typical junction capacitance (Note 2)
Operating junction and storage
temperature range
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
V
F
I
R
trr
Rθ
JL
Rθ
JA
C
J
T
J
T
STG
RS1A
50
35
50
RS1B
100
70
100
RS1D
200
140
200
1.0
30.0
1.30
5.0
50
150
RS1G
400
280
400
RS1J
600
420
600
RS1K
800
560
800
Units
Volts
Volts
Volts
Amp
Amps
Volts
μA
250
35.0
105.0
10.0
-55 to +150
500
ns
℃/W
7.0
pF
℃
Notes:
(1) Test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A.
(2) Measured at 1MHz and applied reverse voltage of 4.0 Volts.
(3) Thermal resistance from junction to ambient and from junction to lead mounted on PCB mounted on
0.2×0.2"(5.0×5.0mm) copper pad areas
DAESAN [ DAESAN ELECTRONICS CORP. ]
