DS1744/DS1744P Y2K-Compliant, Nonvolatile Timekeeping RAMs
PACKAGE INFORMATION (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package
outline information, go to www.maxim-ic.com/DallasPackInfo.)
34-PIN PowerCap
PKG
DIM
MODULE
NOM
MIN
MAX
0.930
0.990
0.080
0.058
0.052
0.025
0.030
A
B
C
D
E
F
IN
IN
IN
IN
IN
IN
IN
0.920 0.925
0.980 0.985
—
—
0.052 0.055
0.048 0.050
0.015 0.020
0.025 0.027
G
NOTE: DALLAS SEMICONDUCTOR RECOMMENDS THAT POWERCAP MODULE BASES
EXPERIENCE ONE PASS THROUGH SOLDER REFLOW ORIENTED WITH THE LABE
SIDE UP (“LIVE-BUG”).
NOTE: HAND SOLDERING AND TOUCH-UP: DO NOT TOUCH OR APPLY THE
SOLDERING IRON TO LEADS FOR MORE THAN 3 SECONDS. TO SOLDER, APPLY FLUX
TO THE PAD, HEAT THE LEAD FRAME PAD, AND APPLY SOLDER. TO REMOVE THE
PART, APPLY FLUX, HEAT THE LEAD FRAME PAD UNTIL THE SOLDER REFLOWS, AND
USE A SOLDER WICK TO REMOVE SOLDER.
COMPONENTS AND PLACEMENT MAY VARY FROM EACH DEVICE TYPE.
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DALLAS [ DALLAS SEMICONDUCTOR ]
