LEAD FREE REFLOW SOLDERING CONDITION
(Applicable to Chip Type Aluminum Electrolytic Capacitors)
Recommended Conditions for Reflow Soldering
(1) A thermal condition system such as infrared radiation (IR) or hot blast should be adopted, and
vapor heat transfer systems (VPS) are not recommended.
(2) Reflow soldering should be performed one time. If the capacitor has to be reflowed twice, 30
minutes must be layout between each time.
(3) For lead-free type reflow soldering, please observe proper conditions below:
a) The time of preheating from 150°C to 200°C shall be within maximum 180 seconds;
b) The time of soldering temperature at 217°C measured on capacitors' top shall not exceed
tL (second);
c) The peak temperature on capacitors' top shall not exceed Tp(°C), and the time within 5°C
of actual peak temperature shall not exceed tp (second).
Classification Reflow Profile
Tp
Ramp-up
*1
tp
Critical Zone
217 t o Tp
21 7
Te m p er a tu r e
20 0
15 0
P re h e a t 1 8 0 s ec Ma x
25
2 5 to Pe a k * 3
t
L
Ramp-down
*2
T im e
Allowable Range of Peak Temperature
Size
4~ 6.3,
8 6.2L
Thickness (mm)
2.5
2.5
2.5
2.5
Volume (mm
3
)
<350
350~2000
350~2000
>2000
*1. Average ramp-up rate is 3 /second max.
*2. Ramp-down rate is 6 /second max.
*3. Time from 25 to peak temperature is 8 minutes max.
Tp(°C)
250±0
240±0
235±0
230±0
t
L
(second)
90
90
60
30 (20*)
tp (second)
5
5
5
5
8 10.5L
10 10.5L/13.5L
12.5,
16
Re:
(20*) is special for mid-to-high voltage which is HU series.
Recommended Land Size (Unit: mm)
Size
4
5
6.3
8×6.2L
8×10.5L
10
12.5
16×16.5/21.5
a
1.6
1.6
1.6
2.1
3.0
4.0
4.0
6.0
b
2.6
3.0
3.5
4.5
3.5
4.0
5.7
6.5
c
1.6
1.6
1.6
1.6
2.5
2.5
3.0
3.5
DB LECTRO Inc. 3755 Place Java, Suite 140, Brossard, Québec, J4Y 0E4, Canada - T: 1-450-444-1424 / F: 1-450-444-4714 / www.dblectro.com
DBLECTRO [ DB LECTRO INC ]
