SO-DIMM Socket for Memory Expansion
Comforming to JEDEC Standard DMM3 Series, 144 Contacts,
0.8mm Pitch
・ Notebook computers, palmtop computers and
handheld devices
FEATURE
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Applicable to 144-position SO-DIMM module
board per JEDEC standard
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Easy mating and unmating with unique locking
and ejecting system
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Surface mount design
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Voltage keying design for 3.3V modules
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DMM3(144)
SPECIFICATION
Voltage rating
Current rating
Dielectric withstanding voltage
Insulation resistance
Contact resistance
100V AC (rms)
0.5A/contact
250V AC (rms) for 1 minute
250MΩ min. at 250V DC
40mΩmax.
MATERIAL/FINISH
Contact/Finish
Insulator
Locking Tab
Copper alloy/Gold over Nickel plating (mating), Tin-Lead (tail)
LCP resin (UL94V-O)/Ivory
Copper alloy/Solder plating
1
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DDK [ DDK LTD. ]
