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MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
LOW THERMAL STRESS STRUCTURE - PASS
5 CYCLE (-55 C TO +150 C) THERMAL SHOCK TEST
DIOTEC ELECTRONICS CORP
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PROPRIETARY HIGH TEMPERATURE JUNCTION
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
PRESS FIT INTO HEAT SINK TO FURTHER ENHANCE
HEAT HANDLING CAPABILITY
HUGE ROUND DIE FOR ULTRA HIGH POWER &
HEAVY DUTY PERFORMANCE
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 5% of Die Area)
MECHANICAL DATA
FEATURES
75 AMP PRESS FIT HIGH VOLTAGE DIODES
0.505
”
/502
”
OVER KNURL
0.007”
0.005”
DT
B7504A
0452
70 Typ.
MECHANICAL SPECIFICATION
78 Places
Equally
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0.052
”
+
0.002”
ALL DIMENSIONS IN INCHES
oHS
R
0.173”
0.157”
0.194”
0.184”
Data Sheet No. B75PF-1A
ROUND DIE
0.250”
T
IAN
L
MP
CO
0.401”
0.385”
0.039”
0.031”
1.02”
0.98”
o
o
DEC [ DIOTEC ELECTRONICS CORPORATION ]
