DIOTEC ELECTRONICS CORP
18020 Hobart Blvd., Unit B
Gardena, CA 90248
Tel.: (310) 767-1052
U.S.A
Fax: (310) 767-7958
Data Sheet No. BUDI-5000D-1A
50 AMP JUMBO DIODE CELL
FEATURES
MECHANICAL SPECIFICATION
Void Free Vacuum Die Soldering For
Maximum Mechanical Strength and Heat
Dissipation (Solder Voids:
Typical < 2%, Max. < 10% of Die Area)
Biggest Effective Die Area for the 50 Amp
Class of Jumbo Diode Cells
High Temperature Solder (Solidus 287 C,
Liquidus 296
O
C) to Allow Higher Operating
And Assembly Temperatures
Copper Headers Are Silver Plated For
Easy Soldering And Superior Solder Joints
Largest Diameter Header Is Cathode
O
Die Size:
0.180" x 0.180"
Square
D
A
Proprietary
Passivation
G
F
Smallest Diameter
Slug Is Anode
B
Largest Diameter
Slug Is Cathode
Silver Plated
Copper Slugs
Silicon Die
MILLIMETERS
DIM
A
B
D
F
MIN
7.25
2.05
6.50
0.72
0.96
MAX
7.35
2.15
6.60
0.82
1.07
INCHES
MIN
0.285
0.080
0.256
0.028
0.038
MAX
0.290
0.085
0.260
0.032
0.042
RoHS COMPLIANT
G
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
Ratings at 25 °C ambient temperature unless otherwise specified.
PARAMETER (TEST CONDITIONS)
SYMBOL
BAR
V
BAR
200
140
200
RATINGS
BAR
400
280
400
BAR
600
420
600
50
600
1.15
BAR
800
560
800
BAR
1000
700
1000
BAR
1200
840
1200
UNITS
Series Number
Maximum DC Blocking Voltage
Maximum RMS Voltage
Maximum Peak Recurrent Reverse Voltage
Average Forward Rectified Current @ T =125 C
Peak Forward Surge Current (8.3mS single half sine wave
superimposed on rated load)
Maximum Forward Voltage Drop at 50 Amps DC
Maximum Average DC Reverse Current
At Rated DC Blocking Voltage
I
5001D 5002D 5004D 5006D 5008D 5010D 5012D
RRM
RMS
100
70
100
V
V
o
VOLTS
C
RRM
I
O
FSM
FM
AMPS
V
1.1 (1.05 Typical)
2
50
0.8
-65 to +175
VOLTS
A
= 25
o
C
o
@ T
A
= 125 C
@ T
I
RM
JC
m
A
°C/W
°C
*)4# @
Maximum Thermal Resistance, Junction to Case (Note 1)
Junction Operating and Storage Temperature Range
Notes: 1) Single Side Cooled
R
G
T ,T
J STG
K15
DEC [ DIOTEC ELECTRONICS CORPORATION ]
