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VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
SURGE OVERLOAD RATING TO 250 AMPS PEAK
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BUILT-IN STRESS RELIEF MECHANISM FOR
SUPERIOR RELIABILITY AND PERFORMANCE
IDEAL FOR PRINTED CIRCUIT BOARD APPLICATIONS
THRU-HOLE FOR EASY HEAT SINK MOUNTING
UL RECOGNIZED - FILE #E124962
RoHS COMPLIANT
DIOTEC ELECTRONICS CORP.
MECHANICAL DATA
FEATURES
6 AMP SILICON BRIDGE RECTIFIERS
SYM
B2
B1
A
B
B3
C1
C2
C
MILLIMETERS
29.7
MIN
3.6
4.4
2.5
0.6
7.3
0.9
9.8
MECHANICAL SPECIFICATION
MAX
30.3
10.2
7.7
0.8
2.9
4.0
4.8
1.1
0.024
0.142
1.17
0.386
0.287
0.098
0.035
MIN
INCHES
0.043
0.157
0.189
f
g
PARAMETER (TEST CONDITIONS)
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
SYMBOL
D
D1
D2
D3
D4
19.7
13.2
3.8
10.8
3.1
20.3
13.8
4.2
11.2
3.3
0.776
0.520
0.126
0.425
0.173
0.122
1.19
0.303
0.031
0.402
0.799
0.543
0.165
0.441
0.114
0.130
MAX
RATINGS
Data Sheet No. BDTC-600-1A
SERIES DT6C00 - DT6C10
UNITS
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