Milli-Cap
®
July 8, 2010
Recommended Attachment Methods (Continued)
•
Recommended Attachment to Soft or Hard Substrate Using Solder:
Recommended Micro Strip Layout:
Solder Thickness:
.004” - .006”
Gap:
.015” - .020”
(.008” - .010” for P21)
Ideal Micro Strip Width:
.020” - .025”
(.012” - .015” for P21)
Solder Diameter:
.020 - .025”
(.010” - .015” for P21)
Distance from Trace Edge:
.001” - .002”
Attachment Method
1. Place a single drop of solder paste onto each micro-strip as illustrated; the edge of the epoxy shall be at
least .001”- .002” back from the edge of the trace to prevent filling the gap with solder.
2. Centering the termination gap of the capacitor within the gap in the micro strip, press with careful, even
pressure onto the micro strip ensuring the terminations make good contact with the drops of solder paste.
3. Reflow according to the solder manufacturer’s preferred profile, ensuring the reflow temperature does not
exceed 250°C.
4. After the reflow step is completed, inspect joint for voids or excess flux and non-reflowed solder balls that
can degrade performance or cause shorts across the gaps. Proper cleaning after the reflow process is
crucial to avoiding performance degradation and discovering poor solder joints.
Isopropanol, and Methanol are both safe to use with soldered Milli-Caps
®
.
Packaging
Packaging Options
Code
Blank
T
S
Description
Generic Waffle Pack
Tape and Reel, 7” Reel, 100pc Minimum, 5,000pc Maximum
(Consult with a sales representative for availability)
Customer Specified
(Drawing required, tooling charges may apply)
2777 Route 20 East, Cazenovia, NY 13035
Dielectric Laboratories Inc.
Phone:
315-655-8710
Fax:
315-655-8179
Email:
sales@dilabs.com
Web:
http://www.dilabs.com
QUALITY SYSTEMS AS9100, ISO 9001 AND ENVIRONMENTAL SYSTEM ISO 14001 CERTIFIED
4 of 4
DILABS [ Dielectric Laboratories, Inc. ]
