Milli-Cap
®
July 8, 2010
Termination Finish and Recommended Attachment Methods
Termination Finish
Code
S
Description
7.5
±
5µ” Au over 50µ” minimum Ni
Recommended Attachment Materials:
•
•
Conductive Epoxy (EPO TEK
®
H20E, Ablebond
®
84-1 LMI, etc.)
Solder (SN62, SN63, etc.)
•
Recommended Attachment to Soft or Hard Substrate Using Conductive Epoxy:
Recommended Micro Strip Layout:
Epoxy Thickness:
.003” - .005”
Gap:
.015” - .020”
(.008” - .010” for P21)
Ideal Micro Strip Width:
.020” - .025”
(.012” - .015” for P21)
Epoxy Diameter:
.010 - .015”
(.005” - .008” for P21)
Distance from Trace Edge:
.003” - .004”
Attachment Method
1. Place a single drop of conductive epoxy onto each micro-strip as illustrated; the edge of the epoxy shall
be at least .003”- .004” back from the edge of the trace to prevent filling the gap with epoxy.
2. Centering the termination gap of the capacitor within the gap in the micro strip, press with careful, even
pressure onto the micro strip ensuring the terminations make good contact with the epoxy drops.
3. Cure according to the epoxy manufacturer’s preferred schedule
•
Typically 125°C to 150°C Max.
4. After curing, inspect joint for epoxy shorts across the termination and micro strip gaps that would cause a
short across the cap.
Isopropanol, and Methanol are both safe to use to pre clean Milli-Caps
®
They are not to be used after mounting with conductive epoxy as they act as a solvent!
2777 Route 20 East, Cazenovia, NY 13035
Dielectric Laboratories Inc.
Phone:
315-655-8710
Fax:
315-655-8179
Email:
sales@dilabs.com
Web:
http://www.dilabs.com
QUALITY SYSTEMS AS9100, ISO 9001 AND ENVIRONMENTAL SYSTEM ISO 14001 CERTIFIED
3 of 4
DILABS [ Dielectric Laboratories, Inc. ]
