BZX84C2V4 - BZX84C39
350mW SURFACE MOUNT ZENER DIODE
Features
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Planar Die Construction
350mW Power Dissipation
Zener Voltages from 2.4V - 39V
Ideally Suited for Automated Assembly Processes
Lead, Halogen and Antimony Free, RoHS Compliant "Green"
Device (Notes 3 and 4)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
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Case: SOT-23
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.008 grams (approximate)
Top View
Device Schematic
Maximum Ratings
Forward Voltage
@T
A
= 25°C unless otherwise specified
@ I
F
= 10mA
Symbol
V
F
Value
0.9
Unit
V
Characteristic
Thermal Characteristics
Characteristic
Power Dissipation
(Note 1)
Power Dissipation
(Note 2)
Thermal Resistance, Junction to Ambient Air
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
Notes:
(Note 1)
(Note 2)
Symbol
P
D
P
D
R
θ
JA
R
θ
JA
T
J,
T
STG
Value
300
350
417
357
-65 to +150
Unit
mW
mW
°C/W
°C/W
°C
1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
2. Valid provided the terminals are kept at ambient temperature.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code OW (week 42, 2009) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code OW are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
BZX84C2V4 - BZX84C39
Document number: DS18001 Rev. 28 - 2
1 of 4
April 2010
© Diodes Incorporated
DIODES [ DIODES INCORPORATED ]
