SPICE MODELS: MBR1030 MBR1035 MBR1040 MBR1045 MBR1050 MBR1060
MBR1030 - MBR1060
10A SCHOTTKY BARRIER RECTIFIER
Features
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Schottky Barrier Chip
Guard Ring Die Construction for
Transient Protection
Low Power Loss, High Efficiency
High Surge Capability
High Current Capability and Low Forward Voltage Drop
For Use in Low Voltage, High Frequency Inverters, Free
Wheeling, and Polarity Protection Application
Lead Free Finish, RoHS Compliant (Note 3)
K
C
D
A
B
L
M
TO-220AC
Dim
A
B
C
D
E
Pin 1
Pin 2
Min
14.48
10.00
2.54
5.90
2.80
12.70
0.69
3.54
4.07
1.15
0.30
2.04
4.83
Max
15.75
10.40
3.43
6.40
3.93
14.27
0.93
3.78
4.82
1.39
0.50
2.79
5.33
Mechanical Data
Case: TO-220AC
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Finish – Bright Tin. Solderable per
MIL-STD-202, Method 208
Polarity: See Diagram
Marking: Type Number
Weight: 2.24 grams (approx.)
E
G
J
R
P
Pin 1
Pin 2
Case
G
J
K
L
M
N
P
R
N
All Dimensions in mm
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
(Note 1)
@T
C
= 125°C
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
(JEDEC Method)
Forward Voltage Drop
Peak Reverse Current
at Rated DC Blocking Voltage
Typical Total Capacitance (Note 2)
Typical Thermal Resistance Junction to Case (Note 1)
Voltage Rate of Change (Rated V
R
)
Operating and Storage Temperature Range
Notes:
@ T
A
= 25°C unless otherwise specified
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
V
FM
I
RM
C
T
R
qJc
dV/dt
T
j,
T
STG
MBR
1030
30
21
MBR
1035
35
24.5
MBR
1040
40
28
10
150
0.84
0.57
0.1
15
400
2.5
1000
MBR
1045
45
31.5
MBR
1050
50
35
MBR
1060
60
42
Unit
V
V
A
A
@ I
F
= 10A, T
C
= 25°C
@ I
F
= 10A, T
C
= 125°C
@T
C
= 25°C
@T
C
= 125°C
0.95
0.70
0.1
25
V
mA
pF
°C/W
V/ms
°C
-65 to +150
1. Thermal resistance junction to case mounted on heatsink.
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
3. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see
DS23009 Rev. 9 - 2
1 of 3
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MBR1030-MBR1060
ã
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