HD01 THRU HD10
MINI SILICON SURFACE MOUNT BRIDGE RECTIFIER
Reverse Voltage - 100 to 1000 Volts
Forward Current - 0.8 Ampere
FEATURES
Surge overload rating - 30 Amperes peak
Ideal for printed circuit board
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Reliable low cost construction utilizing molded
●
Glass passivated device
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Polarity symbols molded on body
●
●
MBS
.275(7.0)MAX
.067(1.7)
.057(1.3)
.051(1.3)
.035(0.9)
.165(4.2)
.150(3.8)
.031(0.8)
.019(0.5) .106(2.7)
.09(2.3)
.014(.35)
.006(.15)
.043(1.1)
.027(0.7)
.067(1.7)
.057(1.3)
MECHANICAL DATA
Case : MBS, Molded Plastic
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Epoxy : Device has UL flammability classification 94V-0
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Mounting Position : Any
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Weight : 0.22 grams (approx.)
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Marking : Type Number
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.193(4.9)
.177(4.5)
.106(2.7)
.09(2.3)
.008(0.2)
1
2
3
4
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (Note 1) @T
A
= 40°C
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)
I
2
t Rating for Fusing (t < 8.3ms)
Forward Voltage per element
Peak Reverse Current
At Rated DC Blocking Voltage
@I
F
= 0.8A
@T
A
= 25°C
@T
A
= 125°C
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
HD01
100
70
HD02
200
140
HD04
HD06
HD08
HD10
Unit
400
280
0.8
600
420
800
560
1000
700
V
V
A
I
FSM
I
2
t
V
FM
I
RM
C
j
R
R
JA
JL
30
10
1.1
5.0
500
25
85
20
-55 to +150
A
A
2
s
V
µA
pF
°C/W
°C
Typical Junction Capacitance per leg (Note 2)
Typical Thermal Resistance per leg (Note 1)
Operating and Storage Temperature Range
T
j
, T
STG
Note: 1. Mounted on glass epoxy PC board with 1.3mm
2
solder pad.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.