SSG-CLD-M2N-1 参数 Datasheet PDF下载

DOMINANT

Semiconductors

Recommended Solder Pad

Note: Component is based on a new package platform, which features “Bottom Only

Terminations”. Solder joints are only formed at the bottom of the component and solder fillet will

not be observable as the sides of the component are not solderable.

Surfaces are not intended for soldering.

19/05/05

S SpiceLED AlInGaP SSx-CLD-v3

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