DIM600XSM45-F000
Single Switch IGBT Module
DS5874-1.1 August 2006
(LN24724)
FEATURES
•
•
•
•
•
•
10µs Short Circuit Withstand
Soft Punch Through Silicon
Lead Free construction
Isolated MMC Base with AlN Substrates
High Thermal Cycling Capability
High isolation module
KEY PARAMETERS
V
CES
V
CE(sat)
*
(typ)
I
C
(max)
I
C(PK)
(max)
4500V
2.9 V
600A
1200A
*(measured at the power busbars and not the auxiliary terminals)
APPLICATIONS
•
•
•
•
High Reliability Inverters
Motor Controllers
Traction Drives
Choppers
The Powerline range of high power modules includes
half bridge, chopper, dual, single and bi-directional
switch configurations covering voltages from 600V to
6500V and currents up to 3600A.
The DIM600XSM45-F000 is a single switch 4500V,
soft punch through n-channel enhancement mode,
insulated gate bipolar transistor (IGBT) module. The
IGBT has a wide reverse bias safe operating area
(RBSOA) plus 10us short circuit withstand. This
device is optimised for traction drives and other
applications requiring high thermal cycling capability.
The module incorporates an electrically isolated base
plate and low inductance construction enabling circuit
designers to optimise circuit layouts and utilise
grounded heat sinks for safety
.
Fig. 1 Single switch circuit diagram
Outline type code: X
ORDERING INFORMATION
Order As:
DIM600XSM45-F000
Note: When ordering, please use the complete part
number
(See package details for further information)
Fig. 2 Electrical connections - (not to scale)
Page 1 of 8Dynex Semiconductor Limited, Doddington Road, Lincoln, United Kingdom, LN6 3LF
Tel: +44-(0)1522-500500 Fax: +44-(0)1522-500550
www.dynexsemi.com
Registered in England and Wales: No 3824626 Registered Office: Doddington Road, Lincoln, United Kingdom, LN6 3LF
DYNEX [ Dynex Semiconductor ]
