GP200MHS12
GP200MHS12
Half Bridge IGBT Module
Replaces GP200MHB12S January 1999 version, DS4339-5.5
DS5296-1.5 November 2000
FEATURES
s
s
s
Non Punch Through Silicon
Isolated Copper Baseplate
Low Inductance Internal Construction
KEY PARAMETERS
V
CES
(typ)
V
CE(sat)
(max)
I
C
(max)
I
C(PK)
1200V
2.7V
200A
400A
APPLICATIONS
s
s
s
s
High Power Inverters
Motor Controllers
Induction Heating
Resonant Converters
11(C
2
)
1(E
1
C
2
)
2(E
2
)
6(G
2
)
7(E
2
)
3(C
1
)
5(E
1
)
4(G
1
)
9(C
1
)
The Powerline range of high power modules includes half
bridge and single switch configurations covering voltages from
600V to 3300V and currents up to 4800A.
The GP200MHS12 is a half bridge 1200V, n channel
enhancement mode, insulated gate bipolar transistor (IGBT)
module. The IGBT has a wide reverse bias safe operating area
(RBSOA) ensuring reliability in demanding applications.
The module incorporates an electrically isolated base plate
and low inductance construction enabling circuit designers to
optimise circuit layouts and utilise earthed heat sinks for safety.
Fig. 1 Half bridge circuit diagram
ORDERING INFORMATION
Order As:
GP200MHS12
Note: When ordering, please use the whole part number.
8
9
5
4
11
10
1
2
3
6
7
Outline type code:
M
(See package details for further information)
Fig. 2 Electrical connections - (not to scale)
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
1/10
www.dynexsemi.com
DYNEX [ Dynex Semiconductor ]
