KHP
FIG.1
OUTPUT CURRENT vs AMBIENT TEMPERATURE
100
400
RHP
FIG.2
NON-REPETITIVE SURGE CURRENT
I
FSM
. PEAK SURGE CURRENT (AMP)
300
240
200
150
100
70
50
% RATED FWD CURRENT
75
KHP
50
RHP
25
0
0
25
50
75
100
( C)
O
30
20
125
150
AMBIENT TEMPERATURE
1
2
3
4
6
8 10
20
30 40
60 80 100
FIG.3
PACKAGE STYLE
CASE STYLE A
OUTLINE
3
8
NUMBER OF CYCLES(60 Hz)
CASE STYLE B
OUTLINE
8-32 THREAD X 1/4 DEEP
(2) MTG. INSERTS
L
1
MAX.
L
1
W
1
4
6-32 THREAD X
1
/
4
DEEP
(2) MTG. INSERTS
1
4
W
1
4
8-32 THREAD X
1
/
4
DEEP
(4) MTG. INSERTS
1
4
1
4
It is recommended that a proper heat sink be used on the terminals of this device between the body and the soldering point to
prevent damage form excess heat.
TEST CIRCUIT
FIG.4
TYPICAL REVERSE RECOVERY WAVEFORM
T RR
R1
50 OHM
D.U.T.
PULSE
GENERATOR
R2
1 OHM
SCOPE
+
-
ZERO
0.5A
REFERENCE
1.0A
0.25A
R1, R2 NON-INDUCTIVE RESISTORS
PULSE GENERATOR - HEWLETT PACKARD 214A OR EQUIV.
IKC REP.RA
TE, 10 SEC. PULSE WIDTH
ADJUST PULSE AMPLITUDE FOR PEAK IR
Prior to the manufacture of these assemblies, the individual silicon junction is measured for
maximum recovery time in the test circuit shown.
ELECTRONIC DEVICES, INC.
DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951.
21 GRAY OAKS AVENUE
* YONKERS. NEW YORK 10710 914-965-4400
* FAX 914-965-5531
* 1-800-678-0828
Ee-mail:sales@edidiodes.com
*
Wwebsite:http://
www.edidiodes.com