Certificate TH97/10561QM
Certificate TW00/17276EM
BYD17D - BYD17M
PRV : 200 - 1000 Volts
Io : 1.5 Amperes
FEATURES :
*
*
*
*
*
Glass passivated
High maximum operating temperature
Low leakage current
Excellent stability
Guaranteed avalanche energy
absorption capability
* Smallest surface mount rectifier outline
* Pb / RoHS Free
GENERAL PURPOSE CONTROLLED
AVALANCHE RECTIFIERS
MELF (Plastic)
Cathode Mark
φ
0.102 (2.6)
0.094 (2.4)
0.022(0.55)
0.205(5.2)
0.189(4.8)
Dimensions in inches and ( millimeters )
MECHANICAL DATA :
* Case : Molded plastic
* Terminals : Plated Terminals, solderable per
MIL-STD-750 Method 2026
* Polarity : Color band denotes cathode end
* Mounting position : Any
* Weight : 0.116 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
RATING
Maximum Repetitive Peak Reverse Voltage
Maximum Crest Working Reverse Voltage
Maximum Continuous Reverse Voltage
Min. Reverse Avalanche Breakdown Voltage at I
R
= 0.1 mA
Maximum Average Forward Current
(Note 1)
Maximum Forward Voltage
Maximum Reverse Current
Ttp = 105 °C
Ta = 65 °C; PCB mounting
at I
F
= 1 A , Tj = 25 °C
at I
F
= 1 A , Tj = Tjmax
at V
R
= V
RRMmax
, Tj = 25 °C
at V
R
= V
RRMmax
, Tj = 165 °C
Typical Reverse Recovery Time (Note 3)
Thermal Resistance from Junction to Tie-Point
Thermal Resistance from Junction to Ambient (Note 4)
Operating Junction Temperature Range
Storage Temperature Range
(Tj = 25 °C unless otherwise specified.)
SYMBOL
V
RRM
V
RWM
V
R
V
(BR)R-min
I
F(AV)
I
FSM
V
F
I
R
I
R(H)
Trr
R
th j-tp
R
th j-a
T
J
T
STG
BYD
17D
200
200
200
225
BYD
17G
400
400
400
450
BYD
17J
600
600
600
650
1.5
0.6
20
1.05
0.93
1.0
100
3
30
150
BYD
17K
800
800
800
900
BYD
17M
1000
1000
1000
1100
UNIT
V
V
V
V
A
A
V
μA
μA
μs
K/W
K/W
°C
°C
Maximum Non-Repetitive Peak Forward Surge Current (Note 2)
- 65 to + 175
- 65 to + 175
Notes :
(1) Averaged over any 20 ms period.
(2) t = 10ms half sine wave; Tj = Tjmax prior to surge; V = V
RRMmax
R
(3) Reverse Recovery Test Conditions : I
F
= 0.5 A, I
R
= 1.0 A, Irr = 0.25 A.
(4) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper
≥
40
μm
Page 1 of 2
Rev. 02 : November 7, 2006
EIC [ EIC DISCRETE SEMICONDUCTORS ]
